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| DISCRETE SEMICONDUCTORS DATA SHEET OM2070B Wideband amplifier module Product specification Supersedes data of October 1991 File under Discrete Semiconductors, SC16 1995 Nov 29 Philips Semiconductors Product specification Wideband amplifier module DESCRIPTION OM2070B A three-stage wideband amplifier in hybrid integrated circuit form on a thin-film substrate. The device is intended for use in mast-head booster amplifiers, as an amplifier in MATV and CATV systems and as a general purpose amplifier for VHF and UHF applications. PINNING PIN 1 2 3 4 5 6 7 8 9 DESCRIPTION input common (-) common (-) common (-) common (-) supply (+) common (-) common (-) output/supply (+) Fig.1 Simplified outline. 9 87 65 4 321 MLA418 pin 1 identification handbook, halfpage 1 QUICK REFERENCE DATA SYMBOL f ZS, ZL GT GT Vo(rms) PARAMETER frequency range source and load impedance transducer gain = S212 flatness of frequency response output voltage (RMS value) dim = -60 dB; 3rd order intermodulation (3-tone) VHF UHF F VB Tamb noise figure DC supply voltage ambient operating temperature - - - 10.8 -20 113 112 4.8 12 - - - - 13.2 +70 dBV dBV dB V C CONDITIONS - - - MIN. 40 - 75 30 1 TYP. MAX. 860 - - - UNIT MHz dB dB 1995 Nov 29 2 Philips Semiconductors Product specification Wideband amplifier module CIRCUIT DIAGRAM AND PRINTED-CIRCUIT BOARD OM2070B C1 handbook, full pagewidth C3 R8 C6 R13 9 R3 R1 1 R2 2,3,4,5 R4 TR1 C2 R6 TR2 C4 R11 TR3 R5 R7 R9 R10 R12 R14 7,8 C5 6 MGA201 Fig.2 Circuit diagram. handbook, full pagewidth 1 9 1 (9x) TOP VIEW L 75 track C C MGA202 75 track BOTTOM VIEW L > 5 H; e.g. catalogue No. 3122 108 20150, or 27 turns enamelled 0.3 mm copper wire wound on a ferrite core with a diameter of 1.6 mm. C > 220 pF ceramic capacitor. Fig.3 Printed-circuit board holes and tracks. 1995 Nov 29 3 Philips Semiconductors Product specification Wideband amplifier module LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VB PIM Tamb Tstg DC supply voltage peak incident powers on pins 1 and 8 ambient operating temperature storage temperature PARAMETER - - -20 -40 MIN. OM2070B MAX. 15 100 +70 +125 V UNIT mW C C CHARACTERISTICS SYMBOL Measuring conditions Tamb VB ZS ZL Z0 f Performance IB GT GT VSWRin VSWRout S122 Vo(rms) supply current transducer gain = S212 input; note 1 output; note 1 f = 100 MHz f = 860 MHz output voltage (RMS value) dim = -60 dB; 3rd order intermodulation (3-tone) VHF UHF F noise figure Operating conditions Tamb VB f ZS ZL Note 1. Highest value (for sample) occurring in the frequency range. ambient operating temperature DC supply voltage frequency range source impedance load impedance -20 10.8 40 - - - 12 - 75 75 +70 13.2 860 - - C V MHz 111 110 - 113 112 4.8 - - - dBV dBV dB flatness of frequency response individual maximum VSWR individual maximum VSWR back attenuation - 28 - - - - - 100 30 1 2.7 1.9 45 35 - 33 - - - - - dB dB mA dB dB ambient operating temperature DC supply voltage source impedance load impedance characteristic impedance of HF connections frequency range - - - - - 40 25 12 75 75 75 - - - - - - 860 C V MHz PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 1995 Nov 29 4 Philips Semiconductors Product specification Wideband amplifier module OM2070B handbook, halfpage 32 MCD445 handbook, halfpage 32 MCD444 S 21 (dB) S 21 (dB) 2 (1) 30 30 (2) (3) 28 28 0 500 f (MHz) 1000 0 500 f (MHz) 1000 Gain over entire frequency range. Z0 = 75 . (1) Maximum gain. (2) Average gain. (3) Minimum gain. Fig.4 Transducer gain as a function of frequency. Fig.5 Power gain. 1995 Nov 29 5 Philips Semiconductors Product specification Wideband amplifier module MOUNTING The module should preferably be mounted on a double-sided printed-circuit board, see Fig.3. Input and output should be connected to 75 tracks. The connection to the common pins should be as close to the seating plane as possible. SOLDERING Hand soldering The maximum contact time for a soldering iron temperature of 260 C up to the seating plane is 5 s. Dip or wave soldering OM2070B The maximum permissible temperature for the solder is 260 C. It must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted against the printed-circuit board, but the temperature of the device must not exceed 125 C. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature below the allowable limit. PACKAGE OUTLINE pin 1 identification handbook, full pagewidth 27 max 5 max seating plane 21 max 1 9 8 7 6 5 0.5 4 3 2 1 2.54 (9x) 4.5 3.0 0.25 MLA417 3 max Dimensions in mm. Fig.6 Resin coated encapsulation. 1995 Nov 29 6 Philips Semiconductors Product specification Wideband amplifier module DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values OM2070B This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1995 Nov 29 7 |
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